(IN BRIEF) Henkel has launched Loctite Stycast UV 7998, a new solvent-free conformal coating that combines strong electronics protection with UL 94 V-0 certification, sustainability benefits, and cost efficiency for mainstream applications such as home appliances, lighting, consumer electronics, and … Read the full press release
Posted in Business, Chemicals, Germany, Industrial, Infrastructure & Utilities, Investment, Management, Netherlands, Technology
Tagged automotive electronics, CO2 reduction, conformal coating, consumer electronics, electronics protection, Henkel, Henkel Adhesives, Henkel Expands Conformal Coatings Portfolio with Solvent-Free UL 94 V-0 Rated Loctite Stycast UV 7998, home appliances, Loctite Stycast UV 7998, moisture cure, Oliver Steinbach, PCB protection, REACH compliant, RoHS compliant, solvent-free, sustainability, UL 94 V-0, UV curing, VOC-free
(IN BRIEF) Henkel will showcase its latest innovations in EMI shielding, thermal management, debonding, and pad printing at Productronica 2025 in Munich, emphasizing sustainability, digitalization, and reliability in electronics manufacturing. The company will launch a new EMI shielding film for … Read the full press release
Posted in Automotive, Business, Chemicals, Electronics & Machinery, Germany, Industrial, Marketing, News, Technology
Tagged and Pad Printing Solutions at Productronica 2025, Anna Ryzhova, automotive electronics, Bart Van Eeghem, Battery Engineering Centers, Circularity, debonding, digital engineering, electronics manufacturing, EMI shielding, EMI testing, Henkel, Henkel Highlights Next-Generation Electronics Innovations and Pad Printing Technologies at Productronica 2025, Henkel Presents Advanced Materials and Digital Engineering Solutions to Drive Sustainable Electronics at Productronica 2025, Henkel to Unveil Advanced EMI Shielding, industrial power, Loctite Stycast CC 8555, Loctite Stycast US 8000AB, Mahmoud Awwad, Messe München, Pad Printing, PCB protection, printed electronics, Productronica 2025, sustainability, TELECOM, thermal interface materials, Thermal Management
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