(IN BRIEF) LPKF Laser & Electronics SE has obtained new patent protection in Korea for its LIDE (Laser Induced Deep Etching) technology, effective September 1, 2025. The process enables ultra-precise, damage-free structuring of thin glass substrates, with applications across semiconductor … Read the full press release
Posted in Business, Electronics & Machinery, Financial, Germany, Industrial, News, Technology
Tagged advanced packaging, co-packaging optics, earthworm structure, high-volume manufacturing, Korean Patent Office, Laser Induced Deep Etching, LIDE technology, LPKF, LPKF Laser & Electronics SE, microsystem manufacturing, precision glass processing, Roman Ostholt, Semiconductor Manufacturing, TGV, through glass vias
(IN BRIEF) LPKF Laser & Electronics SE has joined Onto Innovation’s Packaging Applications Center of Excellence (PACE) to accelerate the production of panel-level packages that use glass cores, crucial for modern semiconductor applications like high-performance computing and AI. LPKF will … Read the full press release
Posted in Business, Electronics & Machinery, Financial, Germany, Government, Industrial, Investment, Management, News, Technology
Tagged advanced packaging, automated inspection, cleanroom, Dr. Roman Ostholt, Firefly® system, glass cores, Hannover, high-volume manufacturing, LIDE technology, LPKF Laser & Electronics SE, metrology, Mike Rosa, Onto Innovation, Pace, Packaging Applications Center of Excellence, partnership, semiconductor, TGV, through glass vias, Vitrion
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