(IN BRIEF) Siemens Digital Industries Software has expanded its partnership with Intel Foundry to enhance the development of advanced semiconductor technologies. This collaboration includes certifications for Siemens’ Calibre® nmPlatform and Solido™ Simulation Suite tools with Intel’s 18A PDK, enabling cutting-edge … Read the full press release →
Posted in Artificial Intelligence (AI), Business, Financial, Germany, Government, Industrial, Infrastructure & Utilities, Internet & Online, Investment, Management, News, Technology
Tagged 18A PDK, 3D IC, advanced packaging, Aprisa software, Calibre nmPlatform, chiplet alliance, chiplets, digital transformation, EMIB-T, GPU, Innovator3D IC, Intel Foundry, partnership, semiconductor design, semiconductor technology, Siemens, Solido Simulation Suite
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30-APR-25: Digi Communications N.V. published its 2024 Annual Financial Report and convened its AGM for 18 June 2025
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