Tag Archives: co packaged optics

STMicroelectronics expands AI infrastructure capabilities with high-volume PIC100 silicon photonics manufacturing and next-generation TSV roadmap

(IN BRIEF) STMicroelectronics has begun high-volume production of its PIC100 silicon photonics platform, a technology designed to support hyperscalers deploying high-speed optical interconnects in data centers and AI computing clusters. Manufactured using 300 mm semiconductor processes, the platform enables advanced … Read the full press release