(IN BRIEF) Nokia has joined the Open Compute Project as a Platinum member, reinforcing its commitment to advancing open, scalable and AI-optimized networking technologies. As AI workloads continue to stress conventional data center and network designs, Nokia will collaborate with … Read the full press release
Posted in Artificial Intelligence (AI), Business, Finland, Infrastructure & Utilities, Management, News, Technology, Telecom
Tagged advanced optics, AI data centers, AI driven network operations, AI networking, AI supercycle, data center scalability, distributed architectures, edge networking, George Tchaparian, high performance switches, IP optical integration, Nokia, Nokia Accelerates Development of AI-Optimized Data Center and Edge Networks by Collaborating with OCP’s Global Community, OCP, Open Compute Project, optical interconnects, Pallavi Mahajan, Platinum membership, PON out of band management
(IN BRIEF) Henkel has launched Loctite TCF 14001, a high-performance liquid thermal interface material designed for advanced optical transceivers used in AI data centers. Featuring a 14.5 W/m-K thermal conductivity — one of the highest among liquid TIMs — the … Read the full press release
Posted in Artificial Intelligence (AI), Business, Chemicals, Electronics & Machinery, Germany, Industrial, News, Technology
Tagged 1.6T, 800G, advanced packaging, AI data centers, automotive electronics, coherent optics, cooling technology, heat management, Henkel, Henkel Expands Advanced TIM Portfolio with Loctite TCF 14001 for Next-Generation High-Density Electronics, high thermal conductivity, industrial automation, Loctite TCF 14001, optical transceivers, power generation, silicone gap filler, telecommunications, Thermal Interface Material, TIM, Tracy Lin
(IN BRIEF) Nokia, working with Keysight Technologies, has successfully tested Ultra Ethernet Transport (UET) traffic across its 7220 and 7250 IXR data center switching platforms, validating their ability to handle the extreme performance requirements of AI and HPC workloads. The … Read the full press release
Posted in Artificial Intelligence (AI), Business, Finland, Industrial, Infrastructure & Utilities, Investment, News, Technology, Telecom
Tagged 7220 IXR, 7250 IXR, AI data centers, AI workloads, AresONE 800GE, DCQCN, high bandwidth, HPC, Keysight Technologies, low-latency, networking infrastructure, Nokia, Nokia and Keysight demonstrate breakthrough in Ethernet-based networking for AI and HPC workloads, Nokia and Keysight demonstrate Ultra Ethernet Transport breakthrough for next-generation AI data centers, Nokia proves UEC 1.0 integration with successful UET test across next-generation switching portfolio, packet loss prevention, Ram Periakaruppan, RoCEv2, Rudy Hoebeke, SR Linux, UEC Specification 1.0, UET, Ultra Ethernet Consortium, Ultra Ethernet Transport
(IN BRIEF) Nokia has partnered with Extreme Broadband (EBB) and its subsidiary Open DC to upgrade six AI data centers in Malaysia using its Data Center Gateway, Data Center Fabric, and quantum-safe networking technologies. The deployment will enhance network performance, … Read the full press release
Posted in Artificial Intelligence (AI), Business, Financial, Finland, Government, Industrial, Infrastructure & Utilities, Internet & Online, Investment, Management, Marketing, News, Technology, Telecom
Tagged 7220 Interconnect Router, 7250 Interconnect Router, AI data centers, banking and finance, Data Center Fabric, Data Center Gateway, DDoS mitigation, digital infrastructure, EBB, enterprise connectivity, Extreme Broadband, Kent Wong, Malaysia, Multi-Cloud Connectivity, MYDIGITAL, National Cloud Computing Policy, Nokia, Open DC, partnership, quantum-safe networks, Wong Weng Yew
(IN BRIEF) Infineon Technologies highlights the transformative potential of gallium nitride (GaN) in driving energy efficiency and decarbonization across industries such as AI, home appliances, electric vehicles, and robotics. The company anticipates rapid growth in GaN adoption, supported by its … Read the full press release
Posted in Business, Environment, Financial, Germany, Industrial, Investment, Management, News, Technology
Tagged 2025 predictions, AI data centers, decarbonization, digitalization, electric vehicles, energy efficiency, gallium nitride, GaN, home appliances, Infineon Technologies, Power Density, power semiconductors, robotics, semiconductor materials, Si, SIC, silicon carbide, sustainability
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