nepes Corporation Advances IC Packaging Capabilities for 3D-IC Era with Siemens Design Solutions

(IN BRIEF) nepes Corporation, a leading global provider of Outsourced Semiconductor Assembly and Test (OSAT) services, has expanded its IC packaging capabilities for the 3D-IC era by adopting advanced design solutions from Siemens EDA. Leveraging Siemens’ industry-leading technologies, including the … Read the full press release →