Infineon Launches CoolSET™ System in Package (SiP) for Efficient Power Delivery in Home Appliances and AI Servers

Infineon Launches CoolSET™ System in Package (SiP) for Efficient Power Delivery in Home Appliances and AI Servers

(IN BRIEF) Infineon Technologies has launched the CoolSET™ System in Package (SiP), a compact and integrated power controller designed to deliver efficient power for applications like home appliances and AI servers. This innovative product eliminates the need for an external heat sink and offers enhanced efficiency, reduced system size, and low EMI emissions. Infineon’s CoolSET SiP integrates several advanced components, providing a reliable and future-proof solution for modern power designs. Samples are available, and a demo will be presented at PCIM Europe 2025.

(PRESS RELEASE) MUNICH, 2-May-2025 — /EuropaWire/ — Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is introducing its new CoolSET™ System in Package (SiP), a compact and highly integrated system power controller designed to deliver up to 60 W of efficient power within a universal input voltage range of 85 – 305 V AC. The CoolSET SiP, housed in a small SMD package, integrates a high-voltage MOSFET with low R DS(ON), eliminating the need for an external heat sink, which significantly reduces system size and complexity.

The CoolSET SiP is engineered for zero-voltage switching (ZVS) flyback operation, which helps reduce switching losses and minimizes EMI emissions, thereby enhancing both system reliability and robustness. These features make the CoolSET SiP an ideal solution for a variety of applications, including major home appliances and AI servers. Additionally, the controller simplifies the design process, enabling developers to meet stringent energy standards and providing future-proof solutions for modern power designs.

The CoolSET SiP integrates several key components, including a 950 V startup-cell, an 800 V avalanche rugged CoolMOS™ P7 SJ MOSFET, a ZVS primary flyback controller, a secondary-side synchronous rectification (SR) controller, and reinforced isolated communication through Infineon’s proprietary CT Link technology. This high level of integration reduces the number of discrete components needed, lowers the bill of materials, and minimizes PCB space, making it easier to develop more sophisticated end products. The SiP also includes advanced protection features, simplifying system integration and offering designers greater flexibility to optimize their solutions and improve the overall user experience.

Availability

Samples of Infineon’s CoolSET System in Package (SiP) are now available for order. A demo version will be showcased at PCIM Europe 2025. Additional details can be found at Infineon’s CoolSET SiP page.

Infineon at PCIM Europe 2025

Infineon will be presenting its latest products and solutions for decarbonization and digitalization at PCIM Europe 2025, taking place from 6 to 8 May 2025 in Nuremberg, Germany. Visit Infineon in Hall 7, Booth #470. The company’s representatives will also be giving presentations at the PCIM Expo stages and participating in the PCIM Conference, followed by discussions with attendees. Media and industry analysts interested in interviews or briefings can reach out via email at media.relations@infineon.com and MarketResearch.Relations@infineon.com. More information about Infineon’s show highlights is available at Infineon PCIM 2025.

Media Contact:

Michael Burner
Tel: +49 89 234 39300
michael.burner@infineon.com

SOURCE: Infineon