(IN BRIEF) Covestro unveiled its innovative thermoplastic polyurethane (TPU) solutions at a symposium in Taipei, highlighting the key role of material innovation in AI-powered smart devices. With advancements in thermal management, durability, and performance, Covestro’s Desmopan® series is revolutionizing industries … Read the full press release →
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Tagged AI applications, Alec Yang, bio-based materials, carbon footprint reduction, Covestro, Desmopan® CQ, Desmopan® IT, Desmopan® XHR, durability, IoT, Kevin Ho, laptop materials, material innovation, partnership, recyclability, robotics, smart devices, smart Wi-Fi routers, sustainability, Taichung, Taiwan, Thermal Management, thermoplastic polyurethane, TPU, wearables