(IN BRIEF) LPKF Laser & Electronics SE has joined Onto Innovation’s Packaging Applications Center of Excellence (PACE) to accelerate the production of panel-level packages that use glass cores, crucial for modern semiconductor applications like high-performance computing and AI. LPKF will … Read the full press release →
Posted in Business, Electronics & Machinery, Financial, Germany, Government, Industrial, Investment, Management, News, Technology
Tagged advanced packaging, automated inspection, cleanroom, Dr. Roman Ostholt, Firefly® system, glass cores, Hannover, high-volume manufacturing, LIDE technology, LPKF Laser & Electronics SE, metrology, Mike Rosa, Onto Innovation, Pace, Packaging Applications Center of Excellence, partnership, semiconductor, TGV, through glass vias, Vitrion