(IN BRIEF) Siemens has enriched its EDA suite with Innovator3D IC™—an AI-powered, capacity-optimized workflow for 2.5D/3D IC planning, layout, protocol compliance, and data governance—and Calibre 3DStress, which integrates transistor-level thermo-mechanical simulation into standard physical verification. Innovator3D IC™’s four modules cover … Read the full press release →
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Tagged 2.5D IC, 3D IC, AI-infused, Bryan Black, Calibre 3DStress, Calibre 3DThermal, Chipletz, Digital Twin, Electronic design automation, Innovator3D IC, Mike Ellow, multiphysics, Sandro Dalle Feste, Siemens Digital Industries Software, Siemens EDA, STMicroelectronics, stress analysis