(IN BRIEF) Infineon has introduced its new generation of 1200 V CoolSiC™ MOSFETs in TO263-7 packaging for automotive applications. These silicon carbide (SiC) MOSFETs offer high power density, efficiency, and enable bi-directional charging. They also reduce system costs in on-board … Read the full press release
(IN BRIEF) Infineon Technologies and Schweizer Electronic are working on a solution to embed Infineon’s 1200 V CoolSiC™ chips directly onto printed circuit boards (PCB) in order to increase the efficiency of chips based on silicon carbide (SiC). The companies … Read the full press release
Posted in Automotive, Business, Electronics & Machinery, Germany, Industrial, Marketing, Technology
Tagged 1200 V CoolSiC™ chips, chip embedding, electric vehicles, Infineon Technologies AG, PCB, PCIM Europe 2023, printed circuit boards, p²Pack®, Robert Hermann, Schweizer Electronic AG, semiconductors, SIC, silicon carbide, Thomas Gottwald
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