(IN BRIEF) Banque Populaire Alsace Lorraine Champagne has provided a €1 million loan to CIMULEC Groupe, marking the first financing operation in France under a €300 million European Investment Bank-backed programme designed to support SMEs in the defence sector through … Read the full press release
Posted in Banks, Business, Defence, European Union, Financial, France, Industrial, Investment, Management, News
Tagged aeronautics industry, Airbus Defence and Space, Banque Populaire Alsace Lorraine Champagne, BPALC, CIMULEC Groupe, CIMULEC Groupe Secures €1 Million Financing from BPALC to Expand High-Tech PCB Production for Defence and Aerospace Markets, defence industrial base, defence sector financing, EIB, European Investment Bank, European strategic autonomy, First EIB-BPCE Defence Financing in France Strengthens CIMULEC Groupe’s Production Capacity in Aeronautics and Space Technologies, France SMEs, Groupe BPCE, industrial technology, innovation financing, Moselle, PCB manufacturing, printed circuit boards, regional banking network, Safran, space industry, Thales, working capital loan
(IN BRIEF) The European Investment Bank (EIB) is providing a €250 million loan to Austria Technologie & Systemtechnik (AT&S), a microelectronics specialist. The loan will support AT&S’s research and development activities and the construction of a new research center in … Read the full press release
Posted in Austria, Banks, Financial, Luxembourg, Technology
Tagged AT&S, Austria Technologie & Systemtechnik AG, digital autonomy, EIB, European Chips Act, European Union, IC substrates, integrated circuit substrates, Leoben, loan, microchips, microelectronics specialist, nanoworld, printed circuit boards, processors, semiconductors, The European Investment Bank, Vienna Stock Exchange
(IN BRIEF) Infineon Technologies and Schweizer Electronic are working on a solution to embed Infineon’s 1200 V CoolSiC™ chips directly onto printed circuit boards (PCB) in order to increase the efficiency of chips based on silicon carbide (SiC). The companies … Read the full press release
Posted in Automotive, Business, Electronics & Machinery, Germany, Industrial, Marketing, Technology
Tagged 1200 V CoolSiC™ chips, chip embedding, electric vehicles, Infineon Technologies AG, PCB, PCIM Europe 2023, printed circuit boards, p²Pack®, Robert Hermann, Schweizer Electronic AG, semiconductors, SIC, silicon carbide, Thomas Gottwald
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