HotPowCon research project successfully concluded Developing packaging and interconnection technology for high operating temperatures Key technology for electromobility in Germany New joining process is lead-free, inexpensive, and reliable Supported by the German Federal Ministry of Education and Research STUTTGART, 1-10-2014 — … Read the full press release
Posted in Education, Electronics & Machinery, Germany, Technology
Tagged Center for Microtechnical Production, Chemnitzer Werkstoffmechanik GmbH, Fraunhofer Institute for Electronic Nano Systems ENAS, Fraunhofer Institute for Reliability and Microintegration IZM, German Federal Ministry of Education and Research, Heraeus Materials Technology GmbH & Co. KG, Hot Power Connection research project, HotPowCon research project, Institute of Applied Systems and Circuits, packaging and interconnection technology, PIT, SEHO Systems GmbH, Siemens AG, Technische Universität Dresden, The Bosch Group, University of Rostock
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