(IN BRIEF) LPKF Laser & Electronics SE has joined Onto Innovation’s Packaging Applications Center of Excellence (PACE) to accelerate the production of panel-level packages that use glass cores, crucial for modern semiconductor applications like high-performance computing and AI. LPKF will … Read the full press release
Posted in Business, Electronics & Machinery, Financial, Germany, Government, Industrial, Investment, Management, News, Technology
Tagged advanced packaging, automated inspection, cleanroom, Dr. Roman Ostholt, Firefly® system, glass cores, Hannover, high-volume manufacturing, LIDE technology, LPKF Laser & Electronics SE, metrology, Mike Rosa, Onto Innovation, Pace, Packaging Applications Center of Excellence, partnership, semiconductor, TGV, through glass vias, Vitrion
(IN BRIEF) At SEMICON Korea 2025, the Busch Group presented its wide-ranging portfolio for the semiconductor industry. Visitors explored innovative vacuum pumps, contamination management, leak detection, and gas abatement solutions through engaging displays, including a unique 3D-printed semiconductor fab model. … Read the full press release
Posted in Business, Electronics & Machinery, Financial, Germany, Government, Industrial, Investment, Management, Marketing, Media, News, Technology
Tagged 3D-printed model, Busch Group, Busch Vacuum Solutions, cleanroom, contamination management, gas abatement, HiPace 3400 IT, leak detectors, low-emissions, Manufacturing, NF3, Pfeiffer Vacuum+Fab Solutions, Semicon Korea 2025, Semiconductor industry, sub-fab management, technology trends, thermal abatement systems, TORRI BD 0600, turbomolecular pump, UltiDry, vacuum pumps, valves
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