Tag Archives: LPKF Laser & Electronics SE

Korean patent strengthens LPKF’s global leadership in precision laser-based glass structuring with LIDE technology

(IN BRIEF) LPKF Laser & Electronics SE has obtained new patent protection in Korea for its LIDE (Laser Induced Deep Etching) technology, effective September 1, 2025. The process enables ultra-precise, damage-free structuring of thin glass substrates, with applications across semiconductor … Read the full press release

LPKF and Onto Innovation Propel Advanced Packaging with Cutting-Edge Glass Processing Solutions

(IN BRIEF) LPKF Laser & Electronics SE has joined Onto Innovation’s Packaging Applications Center of Excellence (PACE) to accelerate the production of panel-level packages that use glass cores, crucial for modern semiconductor applications like high-performance computing and AI. LPKF will … Read the full press release

LPKF Laser & Electronics SE Meets Q1 Guidance, Focuses on Growth Initiatives

(IN BRIEF) LPKF Laser & Electronics SE achieved its Q1 revenue of EUR 25.4 million and adjusted EBIT of EUR -4.3 million, meeting guidance despite challenges in incoming orders due to project delays. The company made strides in key areas, … Read the full press release

LPKF Laser & Electronics SE Reports Stable Revenue and EBIT Amidst Market Challenges

(IN BRIEF) LPKF Laser & Electronics SE disclosed its financial performance for the fiscal year, registering a revenue of EUR 124.3 million and an EBIT of EUR 3.7 million, slightly lower than the previous year’s figures. Despite facing challenges such … Read the full press release