(IN BRIEF) Siemens Digital Industries Software has expanded its strategic collaboration with TSMC by certifying a wide array of EDA tools for TSMC’s most advanced process nodes, including N2P, A16, and 3DFabric® technologies. Siemens’ Calibre®, Solido™, and Analog FastSPICE platforms … Read the full press release
Posted in Business, Environment, Financial, Germany, Government, Industrial, Investment, Management, News, Technology
Tagged 3Dblox, 3DFabric, A14 process, A16 process, AI chip design, Analog FastSPICE, Automotive Semiconductors, AWS cloud certification, Calibre 3DSTACK, Calibre nmPlatform, Calibre PERC, chip stacking, chiplet design, Coupé, hyperscale computing, Lipen Yuan, Mike Ellow, N2P process, open innovation platform, partnership, photonics, semiconductor design, semiconductor EDA tools, Siemens, Solido, sustainability, TSMC
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