(IN BRIEF) STMicroelectronics has expanded its strategic collaboration with Amazon Web Services through a multi-year, multi-billion-dollar agreement that makes ST a key supplier of advanced semiconductors for AWS’s cloud and AI infrastructure, covering high-bandwidth connectivity, intelligent microcontrollers and energy-efficient power … Read the full press release
Posted in Artificial Intelligence (AI), Business, Financial, Government, Industrial, Infrastructure & Utilities, Investment, Management, Switzerland, Technology
Tagged AI Infrastructure, Amazon Web Services, aws, AWS and STMicroelectronics Expand Long-Term Collaboration on Data Centre and AI Hardware, cloud computing, data centres, EDA optimisation, high-performance computing, hyperscale computing, Jean-Marc Chery, microcontrollers, mixed-signal processing, power ICs, semiconductors, share warrants, Silicon Design, STMicroelectronics, STMicroelectronics Deepens Strategic Partnership with AWS for Cloud and AI Infrastructure, technology partnership
(IN BRIEF) Siemens Digital Industries Software has expanded its strategic collaboration with TSMC by certifying a wide array of EDA tools for TSMC’s most advanced process nodes, including N2P, A16, and 3DFabric® technologies. Siemens’ Calibre®, Solido™, and Analog FastSPICE platforms … Read the full press release
Posted in Business, Environment, Financial, Germany, Government, Industrial, Investment, Management, News, Technology
Tagged 3Dblox, 3DFabric, A14 process, A16 process, AI chip design, Analog FastSPICE, Automotive Semiconductors, AWS cloud certification, Calibre 3DSTACK, Calibre nmPlatform, Calibre PERC, chip stacking, chiplet design, Coupé, hyperscale computing, Lipen Yuan, Mike Ellow, N2P process, open innovation platform, partnership, photonics, semiconductor design, semiconductor EDA tools, Siemens, Solido, sustainability, TSMC
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