(IN BRIEF) SÜSS MicroTec SE introduces the XBC300 Gen2 D2W/W2W, a groundbreaking hybrid bonding platform designed for both 200 mm and 300 mm substrates, providing versatile wafer-to-wafer (W2W) and die-to-wafer (D2W) bonding capabilities. This platform is specifically tailored for semiconductor … Read the full press release →
Posted in Business, Financial, Germany, Industrial, Investment, Management, News, Technology
Tagged Dr. Robert Wanninger, Markus Ruff, partnership, semiconductor, SET Corporation SA, SÜSS MicroTec, XBC300 Gen2 D2W/W2W
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