(IN BRIEF) ZEISS Semiconductor Manufacturing Technology is rolling out its new AIMS® EUV 3.0 actinic mask qualification system to leading semiconductor manufacturers worldwide, setting a new benchmark in photomask inspection with improved scanner matching, Digital FlexIllu illumination emulation, and full … Read the full press release
Posted in Business, Electronics & Machinery, Germany, Industrial, Investment, News, Science, Technology
Tagged actinic mask qualification, AIMS EUV, AIMS EUV 3.0, chip production, Digital FlexIllu, Dr Clemens Neuenhahn, High-NA-EUV, lithography, Low-NA-EUV, mask throughput, Oberkochen Germany, photomask inspection, scanner matching, Semiconductor Manufacturing, wafer-level critical dimension, ZEISS Semiconductor Manufacturing Solutions, ZEISS Semiconductor Manufacturing Technology, ZEISS SMT, ZEISS Strengthens Global Semiconductor Support With Advanced AIMS EUV 3.0 and Performance Upgrades for Existing Systems
(IN BRIEF) BASF is expanding its production of semiconductor-grade sulfuric acid at its Ludwigshafen site in Germany to meet the growing demand for chip manufacturing in Europe. The new facility, set to begin operations by 2027, will support key customers … Read the full press release
Posted in Business, Chemicals, Financial, Germany, Industrial, Infrastructure & Utilities, Investment, Management, News, Technology
Tagged advanced semiconductor materials, AI chip applications, automotive, BASF, BASF investment, chemical manufacturing, chip production, Europe, high-purity chemicals, Ludwigshafen, mobile communications, Semiconductor industry, Semiconductor Manufacturing, semiconductor-grade sulfuric acid
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