(IN BRIEF) Siemens Digital Industries Software has expanded its strategic collaboration with TSMC by certifying a wide array of EDA tools for TSMC’s most advanced process nodes, including N2P, A16, and 3DFabric® technologies. Siemens’ Calibre®, Solido™, and Analog FastSPICE platforms … Read the full press release
Posted in Business, Environment, Financial, Germany, Government, Industrial, Investment, Management, News, Technology
Tagged 3Dblox, 3DFabric, A14 process, A16 process, AI chip design, Analog FastSPICE, Automotive Semiconductors, AWS cloud certification, Calibre 3DSTACK, Calibre nmPlatform, Calibre PERC, chip stacking, chiplet design, Coupé, hyperscale computing, Lipen Yuan, Mike Ellow, N2P process, open innovation platform, partnership, photonics, semiconductor design, semiconductor EDA tools, Siemens, Solido, sustainability, TSMC
(IN BRIEF) Infineon Technologies AG maintained its position as the global leader in automotive semiconductors in 2023, as per TechInsights’ latest research. With the global automotive semiconductor market reaching a record size of US$69.2 billion, Infineon’s market share increased to … Read the full press release
Posted in Automotive, Awards, Business, Germany, Industrial, Management, News, Technology
Tagged Asif Anwar, Automotive Semiconductors, Awards, Infineon, leadership, Peter Schiefer
Speech to Include Vision for the Future of Self-Driving Cars and Automotive Semiconductors GRENOBLE, 6-10-2015 — /EuropaWire/ — The Design and Verification Conference (DVCon) & Exhibition Europe 2015 has announced that Hans Adlkofer, the Vice President of the Automotive Systems Group … Read the full press release
Posted in Automotive, Business, Denmark, Electronics & Machinery, Finland, France, Germany, Marketing, News, Sweden, Switzerland, Technology, United Kingdom
Tagged Annette Bley, ARM, automotive electronics, Automotive Semiconductors, Cadence, DVCon, DVCon Europe, Hans Adlkofer, Hr. Hans Adlkofer, Infineon Technologies, Intel, Mentor Graphics, Munich, self-driving cars, Synopsys
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