Tag Archives: AI-infused

Siemens EDA Unveils Innovator3D IC™ and Calibre 3DStress to Streamline 2.5D/3D IC Design and Reliability

(IN BRIEF) Siemens has enriched its EDA suite with Innovator3D IC™—an AI-powered, capacity-optimized workflow for 2.5D/3D IC planning, layout, protocol compliance, and data governance—and Calibre 3DStress, which integrates transistor-level thermo-mechanical simulation into standard physical verification. Innovator3D IC™’s four modules cover … Read the full press release