SUSS.com

(IN BRIEF) SUSS has reported strong Q3 results, with sales of €102.5 million and a 16.9% EBIT margin, continuing a robust growth trend in 2024. The company is expanding production, including a new Taiwan facility, to meet high demand. SUSS … Read the full press release →

(IN BRIEF) SUSS MicroTec SE reported strong financial results for the first half of 2024, with a high order book of €450 million and a significant 45.6% increase in sales to €192.8 million. The Q2 sales reached €99.3 million, driven … Read the full press release →

(IN BRIEF) SÜSS MicroTec SE introduces the XBC300 Gen2 D2W/W2W, a groundbreaking hybrid bonding platform designed for both 200 mm and 300 mm substrates, providing versatile wafer-to-wafer (W2W) and die-to-wafer (D2W) bonding capabilities. This platform is specifically tailored for semiconductor … Read the full press release →