Technische Universität Dresden

The Bosch Group: new packaging and interconnection technology (PIT) to enable electronic power modules operate reliably even at temperatures as high as 300 degrees Celsius

HotPowCon research project successfully concluded Developing packaging and interconnection technology for high operating temperatures Key technology for electromobility in Germany…

10 years ago

SGL Group’s Dr. Hubert Jäger appointed Chair of Lightweight Engineering and Polymer Technology at Technische Universität Dresden

• Dr. Hubert Jäger succeeds Prof. Werner Hufenbach at the ILK • Appointment will strengthen the strategic research area of…

10 years ago