Fraunhofer Institute for Reliability and Microintegration IZM

• Education
• Electronics & Machinery
• Germany
• Technology

The Bosch Group: new packaging and interconnection technology (PIT) to enable electronic power modules operate reliably even at temperatures as high as 300 degrees Celsius

HotPowCon research project successfully concluded Developing packaging and interconnection technology for high operating temperatures Key technology for electromobility in Germany…