On Infineon’s IGBT module EconoPACKTM+ of the new D Series, the contact resistance between the module and heat sink drops by 20 percent with TIM

Published 21, February 2013 at 169 × 113 in New type of paste with enhanced thermal conductivity for modules

On Infineon’s IGBT module EconoPACKTM+ of the new D Series, the contact resistance between the module and heat sink drops by 20 percent with TIM

On Infineon’s IGBT module EconoPACKTM+ of the new D Series, the contact resistance between the module and heat sink drops by 20 percent with TIM

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