The new thermally conductive SEMICOSIL® 975 TC silicone adhesive from WACKER is applied to the heat sink. As the electronic component is pressed on, the adhesive forms a thermal interface (TIM). The adhesive layer transfers the heat of the device efficiently to the heat sink.
SEMICOSIL®
Published 13, November 2014 at 230 × 153 in WACKER developed a thermally conductive adhesive for electronics applications, the SEMICOSIL® 975 TC
Bookmark the permalink.