Siemens EDA Unveils Innovator3D IC™ and Calibre 3DStress to Streamline 2.5D/3D IC Design and Reliability

Siemens EDA Unveils Innovator3D IC™ and Calibre 3DStress to Streamline 2.5D/3D IC Design and Reliability

(IN BRIEF) Siemens has enriched its EDA suite with Innovator3D IC™—an AI-powered, capacity-optimized workflow for 2.5D/3D IC planning, layout, protocol compliance, and data governance—and Calibre 3DStress, which integrates transistor-level thermo-mechanical simulation into standard physical verification. Innovator3D IC™’s four modules cover digital-twin creation, correct-by-design layout, interface analysis, and IP data management, scaling to designs above five million pins. Calibre 3DStress predicts packaging-induced stress and warpage early, safeguarding electrical performance and yield. Industry leaders Chipletz and STMicroelectronics report significant gains in productivity, reliability, and time to market. These additions advance Siemens’ multiphysics and digital-twin strategy for next-generation semiconductor development.

(PRESS RELEASE) MUNICH, 25-Jun-2025 — /EuropaWire/ — Siemens Digital Industries Software today bolstered its Electronic Design Automation (EDA) portfolio with two cutting-edge solutions—Innovator3D IC™ and Calibre 3DStress—designed to tame the growing complexity of 2.5D and 3D integrated circuits. Together, they enable design teams to accelerate project completion while ensuring capacity, performance, compliance, and data integrity at every stage.

Innovator3D IC™ Solution Suite
Built on an AI-infused experience with multithreading and multicore scalability for designs exceeding five million pins, Innovator3D IC™ streamlines heterogeneous integration.

Its four modules cover the entire workflow:

• Integrator: A unified cockpit and digital-twin foundation for design planning, rapid prototyping, and predictive analysis.
• Layout: Correct-by-construction interposer and substrate implementation.
• Protocol Analyzer: Automated compliance checks for chiplet-to-chiplet and die-to-die interfaces.
• Data Management: Centralized control over work-in-progress designs and IP assets.

Calibre 3DStress
With thinner die stacks and higher packaging temperatures, 2.5D/3D ICs face new thermo-mechanical challenges. Calibre 3DStress embeds advanced mechanical simulation into industry-standard physical verification, enabling transistor-level stress and warpage analysis early in the design cycle. By predicting chip-package interactions that can compromise electrical performance, it reduces yield risks and boosts reliability—building on the success of Calibre 3DThermal to offer a comprehensive multiphysics solution.

“Combining Innovator3D IC™ and Calibre 3DStress gives customers a stress-aware multiphysics platform that cuts through 3D IC complexity,” said Mike Ellow, CEO of Siemens EDA. “These tools empower design teams to hit aggressive timelines without sacrificing quality.”

Customer Endorsements

• Chipletz: “Innovator3D IC™ has been pivotal in architecting our AI and HPC platform solutions,” noted Bryan Black, CEO.
• STMicroelectronics: “Calibre 3DStress lets us model IP-level stress and circumvent potential electrical failures, shortening our time to market,” said Sandro Dalle Feste, APMS Central R&D Senior Director.

To explore Siemens’ end-to-end 2.5D/3D IC design ecosystem, visit eda.sw.siemens.com/en-US/ic-packaging/3d-ic-design/.

Siemens Digital Industries Software helps organizations of all sizes digitally transform using software, hardware and services from the Siemens Xcelerator business platform. Siemens’ software and the comprehensive digital twin enable companies to optimize their design, engineering and manufacturing processes to turn today’s ideas into the sustainable products of the future. From chips to entire systems, from product to process, across all industries. Siemens Digital Industries Software – Accelerating transformation.

Siemens Digital Industries (DI) empowers companies of all sizes within the process and discrete manufacturing industries to accelerate their digital and sustainability transformation across the entire value chain. Siemens’ cutting-edge automation and software portfolio revolutionizes the design, realization and optimization of products and production. And with Siemens Xcelerator – the open digital business platform – this process is made even easier, faster, and scalable. Together with our partners and ecosystem, Siemens Digital Industries enables customers to become a sustainable Digital Enterprise. Siemens Digital Industries has a workforce of around 70,000 people worldwide.

Siemens AG (Berlin and Munich) is a leading technology company focused on industry, infrastructure, mobility, and healthcare. The company’s purpose is to create technology to transform the everyday, for everyone. By combining the real and the digital worlds, Siemens empowers customers to accelerate their digital and sustainability transformations, making factories more efficient, cities more livable, and transportation more sustainable. A leader in industrial AI, Siemens leverages its deep domain know-how to apply AI – including generative AI – to real-world applications, making AI accessible and impactful for customers across diverse industries. Siemens also owns a majority stake in the publicly listed company Siemens Healthineers, a leading global medical technology provider pioneering breakthroughs in healthcare. For everyone. Everywhere. Sustainably.

In fiscal 2024, which ended on September 30, 2024, the Siemens Group generated revenue of €75.9 billion and net income of €9.0 billion. As of September 30, 2024, the company employed around 312,000 people worldwide on the basis of continuing operations. Further information is available on the Internet at www.siemens.com.

Note: A list of relevant Siemens trademarks can be found here. Other trademarks belong to their respective owners.

Media Contact:

Siemens Digital Industries Software PR Team
Email: press.software.sisw@siemens.com

SOURCE: Siemens