Siemens and Intel Collaborate to Advance Sustainability in Microelectronics Manufacturing

Siemens and Intel Collaborate to Advance Sustainability in Microelectronics Manufacturing

(IN BRIEF) Siemens AG and Intel Corporation have signed a Memorandum of Understanding (MoU) to work together in enhancing digitalization and sustainability in the field of microelectronics manufacturing. The collaboration aims to advance manufacturing processes, improve factory operations, enhance cybersecurity, and promote a resilient global industry ecosystem. Siemens will leverage its IoT-enabled hardware and software, as well as electrical equipment, to contribute to the partnership’s success. The MoU outlines key areas of collaboration, including optimizing energy management, reducing carbon footprints throughout the value chain, and exploring the use of “digital twins” for efficient manufacturing facilities. The companies aim to drive sustainability practices across the semiconductor lifecycle, aligning with global goals for a more sustainable and efficient chip manufacturing industry.

(PRESS RELEASE) MUNICH, 5-Dec-2023 — /EuropaWire/ — Siemens AG, a leading technology company, and Intel Corporation, one of the world’s largest semiconductor companies, have signed a Memorandum of Understanding (MoU) to collaborate on driving digitalization and sustainability of microelectronics manufacturing. The companies will focus on advancing future manufacturing efforts, evolving factory operations and cybersecurity, and supporting a resilient global industry ecosystem.

“Semiconductors are the lifeblood of our modern economies. Few things run without chips. Therefore, we’re proud to collaborate with Intel to quickly advance semiconductor production. Siemens will bring its entire cutting-edge portfolio of IoT-enabled hardware and software and electrical equipment to this collaboration,” said Cedrik Neike, CEO of Digital Industries and member of the Managing Board of Siemens AG. “Our joint efforts will contribute to achieving global sustainability goals.”

The MoU identifies key areas of collaboration to explore a variety of initiatives, including optimizing energy management and addressing carbon footprints across the value chain. For instance, the collaboration will explore use of “digital twins” of complex, highly capital-intensive manufacturing facilities to standardize solutions where every percentage of efficiency gained is meaningful.

The collaboration will also explore minimizing energy use through advanced modeling of natural resources and environmental footprints across the value chain. To gain more information on product-related emissions, Intel will explore product and supply chain related modeling solutions with Siemens that drive data-based insights and help the industry accelerate progress in reducing its collective footprint.

“The world needs a more globally balanced, sustainable and resilient semiconductor supply chain to meet the increasing demand for chips,” said Keyvan Esfarjani, Intel Executive Vice President and Chief Global Operations Officer. “We are excited to build upon Intel’s advanced manufacturing capabilities by expanding our collaboration with Siemens to explore new areas where we can utilize Siemens’ portfolio of automation solutions to enhance efficiency and sustainability in semiconductor infrastructure, facilities, and factory operations. This MOU will benefit regional and global industry value chains.”

Sustainable practices across the entire semiconductor lifecycle, including design, manufacturing, operation, efficiency, and recycling, are critical for meeting growing demand for powerful, sustainable chips. Technology has the power to accelerate solutions to reduce computing-related climate impacts across the technology industry and the rest of the global economy. Automation and digitalization hold the key to addressing the challenges as the industry drives toward net-zero greenhouse gas emissions. By combining their strengths and expertise, Siemens and Intel are poised to lead the way in driving positive change.

Siemens AG (Berlin and Munich) is a leading technology company focused on industry, infrastructure, transport, and healthcare. From more resource-efficient factories, resilient supply chains, and smarter buildings and grids, to cleaner and more comfortable transportation as well as advanced healthcare, the company creates technology with purpose adding real value for customers. By combining the real and the digital worlds, Siemens empowers its customers to transform their industries and markets, helping them to transform the everyday for billions of people. Siemens also owns a majority stake in the publicly listed company Siemens Healthineers, a globally leading medical technology provider shaping the future of healthcare.
In fiscal 2023, which ended on September 30, 2023, the Siemens Group generated revenue of €77.8 billion and net income of €8.5 billion. As of September 30, 2023, the company employed around 320,000 people worldwide. Further information is available on the Internet at www.siemens.com.

Intel Corporation
Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge, and every kind of computing device, we unleash the potential of data to transform business and society for the better. To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.
© Intel Corporation. Intel, the Intel logo and other Intel marks are trademarks of Intel Corporation or its subsidiaries. Other names and brands may be claimed as the property of others.

Media Contacts:

Simon Krause
Siemens AG
+49 173 403-9683
krause.simon@siemens.com

Jil Huber
Siemens AG
+49 162 347-4144
jil-patricia.huber@siemens.com

Kiana Cacchione
Intel Corporation
+1.602.989.0640
kiana.cacchione@intel.com

SOURCE: Siemens