Infineon Introduces 4.5 kV XHP™ 3 IGBT Modules for Medium Voltage Drives and Transport

Infineon Introduces 4.5 kV XHP™ 3 IGBT Modules for Medium Voltage Drives and Transport

(IN BRIEF) Infineon Technologies AG unveils the 4.5 kV XHP™ 3 IGBT modules, marking a significant shift in medium voltage drives (MVD) and transportation applications. These innovative modules are set to simplify design, reduce component count, and enhance efficiency for applications operating between 2000 and 3300 V AC. With improved isolation and simplified paralleling, the XHP family promises transformative advantages for sectors such as high-speed trains, commercial vehicles, and more, offering cost savings and a smaller footprint.

(PRESS RELEASE) MUNICH, 16-Dec-2023 — /EuropaWire/ — The paradigm shift towards offloading complexity to suppliers and adopting smaller IGBT modules is evident in various applications. In response to the global push for downsizing and integration, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the 4.5 kV XHP™ 3 IGBT modules that will fundamentally change the landscape for medium voltage drives (MVD) and transportation applications operating at 2000 to 3300 V AC in 2- and 3-level topologies. Applications benefiting from the new devices include large conveyor belts, pumps, high-speed trains, locomotives, as well as commercial, construction and agricultural vehicles (CAV).

The XHP family comprises a 450 A dual IGBT module with TRENCHSTOP™ IGBT4 and an emitter-controlled diode, and a 450 A double diode module with emitter-controlled E4 Diode. Both modules feature improved isolation of 10.4 kV. Together, they help to simplify paralleling and downsizing without sacrificing efficiency. Previously, complex busbars were required to parallelize switching modules, resulting in complicated design efforts and leakage inductance. The innovative design of the XHP family simplifies paralleling by conveniently placing the connections side by side. As a result, only a single straight busbar is required for paralleling.

The 4.5 kV XHP family also allows developers to reduce the number of units. Conventional IGBT solutions use multiple single switches and a double diode. With the new devices, however, designs can be reduced to two dual switches and a smaller double diode – a significant step forward in integrated drives.

The combination of the XHP 3 FF450R45T3E4_B5 dual switch and the DD450S45T3E4_B5 double diode enables significant cost savings and a smaller footprint. For example, Infineon’s previous IGBT solutions required four 140 x 190 mm² or 140 x 130 mm² switches and one 140 x 130 mm² double diode. With the new XHP family, the components can be reduced to two 140 x 100 mm² dual switches and a smaller 140 x 100 mm² double diode.

Availability

The IGBT modules FF450R45T3E4_B5 and DD450S45T3E4_B5 are available now. More information is available at www.infineon.com/XHP.

About Infineon

Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The company has around 58,600 employees worldwide and generated revenue of about €16.3 billion in the 2023 fiscal year (ending 30 September). Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the OTCQX International over-the-counter market (ticker symbol: IFNNY).

Further information is available at  www.infineon.com

This press release is available online at  www.infineon.com/press

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Media Contact:

Fabian Schiffer
Tel: +49 89 234 25869
mailto:fabian.schiffer@infineon.com

SOURCE: Infineon