Infineon Expands CoolMOS CFD7A Line with QDPAK Package for Enhanced EV Charging Efficiency

Infineon Expands CoolMOS CFD7A Line with QDPAK Package for Enhanced EV Charging Efficiency

(IN BRIEF) Infineon Technologies AG is extending its 650 V CoolMOS™ CFD7A series by introducing the QDPAK package to meet the growing demand for efficient and high-performance power electronics in electric vehicle (EV) charging systems. The QDPAK package offers equivalent thermal capabilities while improving electrical performance over existing TO247 THD devices. This advancement supports energy-efficient onboard chargers and DC-DC converters, ultimately reducing charging times, vehicle weight, and total ownership costs for EVs. The CoolMOS CFD7A series enhances high-voltage applications with features such as reduced parasitic source inductance, minimized electromagnetic interference (EMI), precise current sensing with a Kelvin source pin, high current capability, and high power dissipation (P tot) of up to 694 W at 25°C. The QDPAK TSC (top side cooled) variant facilitates higher power densities and efficient PCB space utilization, simplifying assembly and reducing system costs. The package also addresses thermal limitations, contributing to a cost-effective and robust solution suitable for modern power requirements. Furthermore, the QDPAK TSC package has become a JEDEC standard for high-power applications, promoting widespread adoption, and additional Automotive Qualified devices are planned for release in 2024, including 750 V and 1200 V CoolSiC™ devices. Both top-side cooled (TSC) and bottom-side cooled (BSC) variants of the 650 V CoolMOS CFD7A in the QDPAK package are currently available for order. More details can be found on Infineon’s website.

(PRESS RELEASE) MUNICH, 23-Nov-2023 — /EuropaWire/ — The accelerated transition to electric vehicles has led to significant innovations in charging systems that demand more cost-efficient and high performing power electronics. Addressing this, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its 650 V CoolMOS™ CFD7A portfolio by introducing the QDPAK package. This package family is designed to provide equivalent thermal capabilities with improved electrical performance over the well-known TO247 THD devices, thus enabling efficient energy utilization in onboard chargers and DC-DC converters.

Efficient and powerful electric vehicle charging systems help reduce charging times and vehicle weight, increasing design flexibility and reduce the total cost of ownership of the vehicle. This new addition complements the existing CoolMOS CFD7A series, offering versatility with top-side and bottom-side cooled packages. The QDPAK TSC (top side cooled), enables designers to achieve higher power densities and optimal PCB space utilization.

The 650 V CoolMOS CFD7A offers several important features for reliable operation in high-voltage applications. Thanks to its reduced parasitic source inductance, the device can minimize electromagnetic interference (EMI), ensuring clear signals and consistent performance. The Kelvin source pin also provides improved precision for current sensing, ensuring accurate measurements even in challenging conditions. With a creepage distance suitable for high voltage applications, as well as high current capability and high power dissipation (P tot) of up to 694 W at 25°C, it is a versatile and powerful device for a wide range of high-voltage applications.

New system designs using 650 V CoolMOS CFD7A in QDPAK TSC will maximize PCB space use, doubling power density and enhancing thermal management via substrate thermal decoupling. This approach simplifies assembly, eliminates board stacking and reduces the need for connectors, thereby lowering system costs. The power switch reduces thermal resistance by up to 35 percent, providing high power dissipation that outperforms standard cooling solutions.

This feature overcomes the thermal limitations of bottom side cooled SMD designs using FR4 PCBs, resulting in a significant boost in system performance. The optimized power loop design locates drivers near the power switch, improving reliability by reducing stray inductance and chip temperatures. Overall, these features contribute to a cost-effective, robust, and efficient system ideal for modern power needs.

As announced in February 2023, the QDPAK TSC package has been registered as a JEDEC standard for high-power applications, helping to establish a broad adoption of TSC in new designs with one standard package design and footprint. To further to accelerate this transition, Infineon will also release additional Automotive Qualified devices in QDPAK TSC for onboard chargers and DC-DC converters in 2024, such as 750 V and 1200 V CoolSiC™ devices.

Availability

The 650 V CoolMOS CFD7A is available in QDPAK package with two versions, top-side cooled (TSC) and bottom-side cooled (BSC). Both variants can be ordered now. More information is available at www.infineon.com/cfd7a.

Media Contact:

Reinhard von Faltin
Tel: +49 89 234 39694
mailto: Reinhard.vonFaltin@infineon.com

SOURCE: Infineon