Infineon Expands Bluetooth Portfolio with Eight New Products in AIROC CYW20829 MCU Family for Diverse Applications

Infineon Expands Bluetooth Portfolio with Eight New Products in AIROC CYW20829 MCU Family for Diverse Applications

(IN BRIEF) Infineon Technologies has expanded its Bluetooth portfolio with eight new products in the AIROC CYW20829 Bluetooth Low Energy 5.4 MCU family. These new offerings, optimized for industrial, consumer, and automotive applications, provide highly integrated solutions that reduce costs and device footprints. The family includes the AIROC CYW89829 MCU, ideal for automotive applications like car access and wireless battery management systems. Early feedback from industry leaders has been positive, highlighting the products’ strong RF performance and advanced features. The new products are available in various package options, with additional variants expected by mid-2025.

(PRESS RELEASE) MUNICH, 13-Aug-2024 — /EuropaWire/ — Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has announced the expansion of its Bluetooth® portfolio with the introduction of eight new products within the AIROC™ CYW20829 Bluetooth Low Energy 5.4 microcontroller (MCU) family. These new System-on-Chip (SoC) and module offerings are specifically designed for a variety of industrial, consumer, and automotive applications, providing highly integrated solutions that help reduce both the bill of materials (BOM) cost and device footprint. The expanded product lineup is well-suited for a range of applications, including PC accessories, low-energy audio devices, wearables, solar micro inverters, asset tracking systems, health and lifestyle products, and home automation, among others.

One of the key highlights is the AIROC CYW89829 Bluetooth Low Energy MCU, tailored for automotive applications such as car access and wireless battery management systems (wBMS). This latest addition to the product family features robust RF performance, extended range, and the latest Bluetooth 5.4 functionalities, including Periodic Advertising with Responses (PAwR). The dual ARM® Cortex® core design integrates separate subsystems for application and Bluetooth Low Energy tasks, ensuring comprehensive support for Bluetooth 5.4, low power consumption, and secure operations with features like Root of Trust (RoT) and PSA level 1 readiness.

Shantanu Bhalerao, Vice President of the Bluetooth Product Line at Infineon Technologies, emphasized the versatility of the new offerings: “Infineon’s expanded Bluetooth portfolio delivers robust connectivity and cutting-edge features across automotive, industrial, and consumer markets. The AIROC CYW89829 and CYW20829 MCUs offer ultra-low power and high integration, enhancing user experience and enabling a wide array of applications.”

The CYW20829 family has already received positive feedback from early adopters. Kevin Wang, CEO of ITON, praised the CYW20829 as a leading Bluetooth solution that meets the latest Bluetooth 5.4 certification standards, citing its strong RF performance and support for PAwR and LE Audio as key advantages for consumer and industrial markets. Similarly, Cai Yi, CEO of Pairlink, noted the chip’s excellent RF performance and long-range capabilities as ideal for commercial lighting and industrial IoT applications. Tapan Pattnayak, Chief Scientist at Addverb, highlighted how the CYW20829’s features have enabled the development of a secure monitoring and control system for industrial warehouse robots.

The new products in the AIROC CYW20829 Bluetooth LE MCU family are available in various package options tailored to specific applications. Several products are already in production, while others are currently in the sampling phase, with additional variants expected to be available by the second quarter of 2025.

About Infineon

Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The company has around 58,600 employees worldwide and generated revenue of about €16.3 billion in the 2023 fiscal year (ending 30 September). Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the OTCQX International over-the-counter market (ticker symbol: IFNNY).

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Media Contact:

Veronika Seifried
Tel: +49 89 234 25869
Veronika.Seifried@infineon.com

SOURCE: Infineon Technologies AG