Henkel Launches Bergquist Gap Filler TGF 6500LVO for Automotive Electronics Thermal Management

(IN BRIEF) Henkel Adhesive Technologies has launched Bergquist Gap Filler TGF 6500LVO, a next-generation thermal gap filler with 6.5W/m∙K thermal conductivity for automotive electronics applications. The material is designed to support heat transfer in demanding systems such as ADAS, electronic control units and power conversion components in electric vehicles. It combines high thermal conductivity with low bond line thickness, low-volatile silicone technology and reliable performance at temperatures of up to 150°C. Henkel said the product is suitable for automated production and high-throughput manufacturing, with room-temperature or heat-accelerated curing options. It expands the company’s Bergquist thermal gap filler portfolio, giving OEMs and component manufacturers more flexibility in addressing rising thermal loads.

(PRESS RELEASE) DÜSSELDORF, 22-Jul-2026 — /EuropaWire/ — Henkel Adhesive Technologies has launched Bergquist Gap Filler TGF 6500LVO, a next-generation thermal gap filler designed to support the growing thermal management demands of automotive electronics.

The new material offers 6.5W/m∙K thermal conductivity, helping manufacturers improve heat transfer in critical vehicle systems as power density and thermal loads continue to rise.

Henkel said the product has been developed for advanced automotive applications such as advanced driver assistance systems, electronic control units and power conversion components in electric vehicles.

As vehicle electronics become more powerful and compact, manufacturers require materials that can manage heat effectively while supporting performance, reliability and efficient production.

Bergquist Gap Filler TGF 6500LVO is a two-component thermal gap filler based on low-volatile silicone technology.

The material is designed to reduce thermal resistance and improve efficiency in compact electronic systems. It combines high thermal conductivity with a low bond line thickness, giving designers greater flexibility in space-constrained applications while maintaining thermal performance.

The gap filler provides reliable performance at operating temperatures of up to 150°C. It is also suitable for siloxane-sensitive applications that require low fogging or minimal outgassing.

Henkel said the product offers fast and robust dispensing characteristics, making it suitable for automated production lines and high-throughput manufacturing environments.

Bergquist Gap Filler TGF 6500LVO can be cured at room temperature or through heat-accelerated processes, supporting flexible production requirements and efficient manufacturing workflows.

The product expands Henkel’s next-generation thermal gap filler portfolio, joining Bergquist Gap Filler TGF 2100LVO, Bergquist Gap Filler TGF 2900LVO, Bergquist Gap Filler TGF 4400LVO and Bergquist Gap Filler TGF 10000.

Together, the range allows customers to select materials based on their required level of thermal performance and application needs.

Nancy Yang, Business Development Manager Automotive Electronics at Henkel, said the company’s next-generation thermal gap fillers help OEMs and component manufacturers balance increasingly complex automotive electronics requirements.

She said these requirements include thermal management, sustainability and streamlined production cycles.

“Bergquist Gap Filler TGF 6500LVO is exceptionally thermally conductive, and high-performing,” said Yang.

She added that the new product adds another dimension to Henkel’s range, giving customers more options to address rising thermal loads and stay ahead of emerging design and manufacturing challenges.

Henkel said the launch strengthens its portfolio of materials for high-performance automotive electronics and supports manufacturers as they develop more compact, reliable and thermally efficient vehicle systems.

Media Contact:

Sebastian Hinz
Adhesive Technologies
Media Relations
Headquarters, Düsseldorf/Germany
+49-211-797-8594
press@henkel.com

SOURCE: Henkel