Collaboration between Infineon and Schweizer promises to improve electric vehicle efficiency

Collaboration between Infineon and Schweizer promises to improve electric vehicle efficiency

(IN BRIEF) Infineon Technologies and Schweizer Electronic are working on a solution to embed Infineon’s 1200 V CoolSiC™ chips directly onto printed circuit boards (PCB) in order to increase the efficiency of chips based on silicon carbide (SiC). The companies have already demonstrated the potential of this approach with a 48 V MOSFET embedded in the PCB which resulted in a 35% increase in performance. They plan to showcase this technology at PCIM Europe 2023 in Nuremberg.

(PRESS RELEASE) MUNICH/ SCHRAMBERG, 26-Apr-2023 — /EuropaWire/ — Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a German semiconductor manufacturer, and Schweizer Electronic AG (ETR: SCE) have teamed up to develop an innovative solution to improve the efficiency of chips based on silicon carbide (SiC). The companies are working on a way to embed Infineon’s 1200 V CoolSiC™ chips directly onto printed circuit boards (PCBs), a move that would increase the range of electric vehicles and reduce total system costs.

The two partners have already demonstrated the potential of this approach by embedding a 48 V MOSFET in the PCB, which resulted in a 35% increase in performance. SCHWEIZER’s p²Pack® solution, which enables power semiconductors to be embedded in PCBs, contributes to the success of this new technology.

“Our joint goal is to take automotive power electronics to the next level,” said Robert Hermann, Product Line Head Automotive High-Voltage Discretes and Chips, of Infineon. “The low-inductive environment of a PCB allows clean and fast switching. Combined with the leading performance of 1200 V CoolSiC™ devices, chip embedding enables highly integrated and efficient inverters that reduce overall system costs.”

“With Infineon’s 100 percent electrically tested standard cells (S-Cell), we can achieve high overall yields in the p² Pack manufacturing process,” said Thomas Gottwald, Vice President Technology at Schweizer Electronic AG. “The fast-switching characteristics of the CoolSiC chips are optimally supported by the low-inductance interconnection that can be achieved with the p² Pack. This leads to increased efficiency and improved reliability of power conversion units such as traction inverters, DC-DC converters, or on-board chargers.”

Infineon and SCHWEIZER plan to showcase the 1200 V CoolSiC chip embedding technology at PCIM Europe 2023 in Nuremberg, with Infineon at booth 412 in Hall 7 and SCHWEIZER at booth 410 in Hall 6.

This collaboration represents a significant step towards more efficient and cost-effective SiC chip production and promises to have a positive impact on the electric vehicle market.

Media contact:

Reinhard von Faltin
T +49 89 234 39694
Reinhard.vonFaltin@infineon.com

SOURCE: Infineon Technologies AG