AIXTRON Honored with Gold Supplier Award for Micro LED Collaboration with BOE HC SemiTek

AIXTRON Honored with Gold Supplier Award for Micro LED Collaboration with BOE HC SemiTek

(IN BRIEF) AIXTRON, a leading provider of deposition equipment, has been awarded the prestigious Gold Supplier Award by BOE HC SemiTek for their exceptional collaboration in the field of Micro LED technology. The partnership, spanning over 19 years, has evolved into a close alliance focused on advancing 150mm gallium nitride (GaN) and arsenide-phosphide (AsP) materials for Micro LED development. AIXTRON’s specialized technology solutions, including ultra-low defect processes and wafer-level binning control, have played a pivotal role in accelerating Micro LED product development, meeting stringent requirements while maintaining cost efficiency. The Gold Supplier Award acknowledges AIXTRON’s dedication to excellence and breakthroughs in Micro LED technology, fostering innovation in the display segment.

(PRESS RELEASE) HERZOGENRATH, 8-Apr-2024 — /EuropaWire/ — AIXTRON (FSE: AIXA) has received the prestigious Gold Supplier Award from BOE HC SemiTek for their collaboration in the field of Micro LED technology. The partnership between the leading provider of deposition equipment to the semiconductor industry and BOE HC SemiTek spans over 19 years, dating back to the early 2000s. What began as a shared commitment to excellence has since 2022 evolved into a close collaboration, focusing on 150mm gallium nitride (GaN) and arsenide-phosphide (AsP) materials for the development of Micro LED technologies.

BOE HC SemiTek, a leading supplier in the display segment, operates multiple AIXTRON GaN and GaAs (gallium arsenide) tools worldwide. These tools are specifically tailored for Display LED applications and are crucial in producing state-of-the-art premium displays for OEM partners worldwide. AIXTRON systems have been instrumental in accelerating the development of Micro LED products, which has led to multiple repeat orders for AIXTRON’s GaN and GaAs tools in preparation of a volume ramp of Micro LED products in BOE HC SemiTek.

Micro LEDs are the important technological choice for next generation displays, from large displays to automotive applications or an enhanced AR/VR experience. However, the complexity of Micro LED technology and the pressure for cost reduction demands end-to-end cooperation between suppliers and end-users.

AIXTRON’s unique technology solutions are engineered specifically to meet the stringent requirements. These solutions include an ultra-low defect process and wafer-level binning control, all while maintaining a low cost of epitaxy per wafer. Thanks to highly efficient large batch reactors and full automation, AIXTRON continues to push the boundaries of Micro LED technology.

“The collaboration with BOE HC SemiTek is very significant for us as a company and for the development of Micro LED technology in general. For more than five years, we have focused on further optimizing our solutions for Micro LED.  We are very grateful that our great efforts and breakthroughs in this area are now honored with this prestigious award from one of the leading companies in Micro LED technology. Our gratitude extends to our dedicated technology teams at our headquarters, whose tireless efforts have fueled our success. Equally deserving of recognition is our exceptional team of AIXTRON China, which translated all the latest developments into productivity and therefore cost gains for our partner BOE HC SemiTek”, said Dr. Felix Grawert, CEO and President of AIXTRON SE.

“The Gold Supplier Award is given to companies who had a unique contribution towards the industry development while maintaining an exceptional day-to-day service response. We are very grateful for our partnership with AIXTRON as our teams have fostered a level of collaboration unmatched in the industry. This teamwork has unlocked groundbreaking results that we initially thought impossible. Micro LED technology demands a constant push of boundaries, and with AIXTRON as a valued partner, we are confident in achieving our ambitious product goals”, said Mr. Zhaohong Zhang, Chairman of BOE HC SemiTek.

About AIXTRON

AIXTRON SE is a leading provider of deposition equipment to the semiconductor industry. The Company was founded in 1983 and is headquartered in Herzogenrath (near Aachen), Germany, with subsidiaries and sales offices in Asia, United States, and in Europe. AIXTRON´s technology solutions are used by a diverse range of customers worldwide to build advanced components for electronic and optoelectronic applications based on compound or organic semiconductor materials. Such components are used in a broad range of innovative applications, technologies and industries. These include Laser and LED applications, display technologies, data transmission, SiC and GaN power management and conversion, communication, signaling and lighting as well as a range of other leading-edge applications.

Our registered trademarks: AIXACT®, AIXTRON®, Atomic Level SolutionS®, Close Coupled Showerhead®, CRIUS®, Gas Foil Rotation®, OVPD®, Planetary Reactor®, PVPD®, TriJet®

For further information on AIXTRON (FSE: AIXA, ISIN DE000A0WMPJ6) please visit our website at: www.aixtron.com

Forward-Looking Statements

This document may contain forward-looking statements regarding the business, results of operations, financial condition and earnings outlook of AIXTRON. These statements may be identified by words such as “may”, “will”, “expect”, “anticipate”, “contemplate”, “intend”, “plan”, “believe”, “continue” and “estimate” and variations of such words or similar expressions. These forward-looking statements are based on our current assessments, expectations and assumptions, of which many are beyond control of AIXTRON, and are subject to risks and uncertainties. You should not place undue reliance on these forward-looking statements. Should these risks or uncertainties materialize or should underlying expectations not occur or assumptions prove incorrect, actual results, performance or achievements of AIXTRON may materially vary from those described explicitly or implicitly in the relevant forward-looking statement. This could result from a variety of factors, such as actual customer orders received by AIXTRON, the level of demand for deposition technology in the market, the timing of final acceptance of products by customers, the condition of financial markets and access to financing for AIXTRON, general conditions in the market for deposition plants and macroeconomic conditions, cancellations, rescheduling or delays in product shipments, production capacity constraints, extended sales and qualification cycles, difficulties in the production process, the general development in the semi-conductor industry, increased competition, fluctuations in exchange rates, availability of public funding, fluctuations and/or changes in interest rates, delays in developing and marketing new products, a deterioration of the general economic situation and any other factors discussed in any reports or other announcements , in particular in the chapter Risks in the Annual Report, filed by AIXTRON. Any forward-looking statements contained in this document are based on current expectations and projections of the executive board based on information available the date hereof. AIXTRON undertakes no obligation to revise or update any forward-looking statements as a result of new information, future events or otherwise, unless expressly required to do so by law.

This document is also available in a German language translation version. In case of discrepancies, the English language document shall prevail and shall be the valid version.

Media Contact

Media Relation:
Ragah Dorenkamp
Director Corporate Communications
fon: +49 (2407) 9030-1830
e-mail r.dorenkamp@aixtron.com

Investors Relation:
Carsten Werle
Director Investor Relations (interim)
fon: +49 (2407) 9030-8815
e-mail c.werle.sc@aixtron.com

SOURCE: AIXTRON