Tag Archives: Technische Universität Dresden

The Bosch Group: new packaging and interconnection technology (PIT) to enable electronic power modules operate reliably even at temperatures as high as 300 degrees Celsius

HotPowCon research project successfully concluded Developing packaging and interconnection technology for high operating temperatures Key technology for electromobility in Germany New joining process is lead-free, inexpensive, and reliable Supported by the German Federal Ministry of Education and Research STUTTGART, 1-10-2014 — … Read the full press release

SGL Group’s Dr. Hubert Jäger appointed Chair of Lightweight Engineering and Polymer Technology at Technische Universität Dresden

• Dr. Hubert Jäger succeeds Prof. Werner Hufenbach at the ILK • Appointment will strengthen the strategic research area of lightweight engineering Wiesbaden / Dresden, 30-4-2014 — /EuropaWire/ — Dr. Hubert Jäger, head of SGL Group’s R&D organization, has been appointed … Read the full press release